Nvidia, Samsung Electronics, SK hynix: Strengthening AI Alliance and Packaging Cooperation
Nvidia CEO Jensen Huang met with Samsung Electronics Chairman Lee Jae-yong and SK Chairman Chey Tae-won in New York for the first time in two months. The meeting shows that the main topic of the AI chip market is expanding from high-bandwidth memory (HBM) to packaging technology.
As competitors emerge, Nvidia is pursuing HBM supply chain diversification along with cost reduction and efficiency strategies. Nvidia aims to strengthen its position in the AI chip market through new partnerships.
Ways to maximize investment efficiency by sharing technology from the design stage were discussed. This gives Korean chip companies an opportunity to participate more deeply in Nvidia's AI ecosystem.


